Form：爱集微 2026/4/15Browse：612

As AI chips have increasingly higher requirements for performance and integration, advanced packaging and substrate technologies have become crucial in semiconductor competition.Samsung Electro-Mechanics is reportedly bu...

Form：集微网 2018/3/15Browse：5014

In order to meet the needs of data analysis in various fields, AMD has recently launched a series of EPYC 3000 and AMD Ryzen V1000 two embedded processor products. Among them, in the field of industrial embedded computer...

Form：Hua Hong Semiconductor 2017/12/27Browse：4912

Hua Hong Semiconductor Co., Ltd. today announced the successful mass production of its second-generation 90-nm G2 eFlash process platform with enhanced technical strength and competitiveness.

Form：ADLINK TECHNOLOGY 2017/6/13Browse：4588

Linghua Technology, the world's leading provider of edge computing platform, announced the launch of the new embedded fanless computer MVP-5000, which carries the sixth generation Intel Core processor, computing performance beyond the previous generation processor 30%